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Millison provides a full range of Electronics Manufacturing Services. These
include:
 | Surface Mount and Mixed Technology Assembly:
 | All assembly types:
 | Type 1 Assembly: SMDs mounted on one or both sides of the board. |
| Type 2 Assembly: mixed technology having leaded (through-hole)
parts mounted on the primary side and SMDs on one or both sides. |
| Type 3 Assembly: mixed technology featuring passive SMDs on the
secondary side and leaded components mounted to the primary side. |
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| Through Hole Assembly:
| Wave soldered: up to 300mm width. |
| Hand soldered: |
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| Low stress board break out: Millison provides low stress breakout of:
| V Grooved PCB's. |
| Routed PCB's. Preferred route widths: 2mm, 2.4mm and 2.5mm. |
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| Aqueous / Semi-Aqueous Cleaning: |
| Conformal Coating: |
| Circuit Potting: |
| Testing:
| Functional Testing: |
| Manufacturing Defect Analysis: |
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| Final Product Assembly: |
| Packaging and Despatch: |
 Type
1 Assembly: Surface Mount Components mounted on one or both sides of
the board.
 Type
2 Assembly: Mixed technology having leaded (through-hole) parts
mounted on the primary side and SMDs on one or both sides.
 Type
3 Assembly: Mixed technology featuring passive SMDs on the secondary
side and leaded components mounted to the primary side.
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